防微振介绍参考课件.ppt

1、1Vibration and Noise Design of Advanced Technology FacilitiesAhmad Bayat,P.E.J.Byron DavisVibro-Acoustic Consultants29 June 20042Vibration and Noise Design of Advanced Technology FacilitiesI.Brief background on VACCII.Vibration Design of FacilitiesProblem DefinitionTwo Design FundamentalsIII.Noise D

2、esign of FacilitiesIV.Tool Hook-UpV.Structural Evaluation3Background on VACCOur background4Western U.S.:Intel Fabs LCE,C6,11,12,22,23;Sandia Natl Labs;HP Fort Collins;Motorola COM1,MOS12,and Flat Panel;Micron Lehi,Boise,and Mask Shop;Atmel;Vitesse;Philips Fab 25;Microchip(Phoenix);NCR Projects Unite

3、d StatesTexas:Atmel;Motorola ULSI/MOS13;TI DMOS5,DMOS6,Kilby Center;AMD Fab 25;Samsung;Methodist Heart Center(Lubbock)East Coast:IBM(Burlington,East Fishkill);Dominion Semiconductor;Lucent(Orlando);Seagate(Pitts.);Natl Security Agency(Ft.Meade)5California:Intel Fabs D2,SC1,SC2,and IMO;Stanford Unive

4、rsity;AMAT Bldg.s 2,3,92,Arques Center,Scott Campus;IBM San Jose;IDT;LAM Research;Vishay/Siliconix;National Semiconductor;Linear Technology;AT&T;UC Campuses at Berkeley,Davis,and San Francisco;Lawrence Berkeley National Labs;Lawrence Livermore Natl Labs/National Ignition Facility;Projects US West Co

5、astPacific Northwest:Intel Fabs D1B,D1C,RB1,15,and Pathfinder;Hyundai;WaferTech Camus;Fujitsu Gresham;LSI Logic;IDT MASCA;Maxim;Seattle Ferry Terminal;University of Washington Cal Poly San Luis Obispo;International Rectifier;UC Irvine;ST Microelectronics6Projects Southeast AsiaTaiwan,R.O.C.:TSMC Fab

6、s 3,6,and 7;WaferTech;Quanta TFT;Arima;Formosa;Nan Ya Fabs 1 and 3;Winbond;Formosa;Macronix;OPTO Fab;AMAT Taiwan;Eagle TFT Fab;UMC;Powerchip Fab 2;Acer;Chunghwa Picture Tube;NanYa/Inotera China:Motorola Tianjin MOS17,MOS17-XKorea:CTIS Korea;AMAT Korea Thailand:SMTMalaysia:WTM/SilterraSingapore:ST Mi

7、croelectronics AMK8 7Projects EuropeScotland:Motorola East KillbrideIreland:Intel Fabs 10,24Italy:ST Microelectronics Catania M6France:ST Microelectronics Rousset 8Problem Definition:ProcessesBasic ResearchUniversities,National LabsCorporate R&DSemiconductors,DevicesFlat Panel Display TechnologiesPh

8、armaceuticals,BiotechnologyNanotechnology Mature ProcessesDeveloping ProcessesManufacturingMicroelectronics,Flat Panel DisplaysPharmaceuticals,Biotechnology ToolsNanotechnology(coming soon)Vibration Design of Advanced Technology Facilities9Problem Definition:Why Vibration?Submicron manufacturing/R&D

9、 usually in a super-clean environmentSensitivity vs.power:100/100 ruleMarriage of“Beauty”and“Beast”Vibration Design of Advanced Technology Facilities10Problem Definition:Sourcesv Rotating machinery(tones/BB)unknownv Piping/ductwork turbulence(BB)unknownv Movement of people/materials(BB)knownv Enviro

10、nmental sources usually knownVibration Design of Advanced Technology Facilities11Local&Environmental Sources12Typical Floor Vibration DataNarrowband(Bandwidth=0.46875)0.11.010.0100.01000.0110100Frequency Hz RMS Velocity micro-in/s NarrowbandTones vs.Broadband“Tones”“Broadband Random Excitation”Vibra

11、tion Design of Advanced Technology Facilities13Typical Floor Vibration DataNarrowband(Bandwidth=0.46875)0.11.010.0100.01000.0110100Frequency Hz RMS Velocity micro-in/s NarrowbandTones vs.BroadbandttDeterministic Sine Wave(tone)Frequency at Shaft SpeedAmplitude Unbalanced ForceVibration Design of Adv

12、anced Technology Facilities14Typical Floor Vibration DataSummed 1/3 Octave BandVC-DVC-E1.010.0100.01000.0110100Frequency Hz RMS Velocity micro-in/s 1/3 Octave BandVC-D(250 micro-in/s)VC-E(125 micro-in/s)1/3 Octave Band DataDominated by 30Hz toneDominated by 60Hz toneVibration Design of Advanced Tech

13、nology Facilities151/3 Octave Band vs.Narrowband DataTypical Floor Vibration DataNarrowband,Resulting 1/3 Octave Band Data Overlay0.11.010.0100.01000.0110100Frequency Hz RMS Velocity micro-in/s Narrowband1/3 Octave BandVibration Design of Advanced Technology Facilities16Importance of TonesTypical Fl

14、oor Vibration DataNarrowband(Bandwidth=0.46875)0.11.010.0100.01000.0110100Frequency Hz RMS Velocity micro-in/s Typical Floor Vibration DataNarrowband(Bandwidth=0.46875)0.11.010.0100.01000.0110100Frequency Hz RMS Velocity micro-in/s Vibration Design of Advanced Technology Facilities17Importance of To

15、nesTypical Floor Vibration DataSummed 1/3 Octave BandVC-DVC-E1.010.0100.01000.0110100Frequency Hz RMS Velocity micro-in/s Typical Floor Vibration DataSummed 1/3 Octave BandVC-DVC-E1.010.0100.01000.0110100Frequency Hz RMS Velocity micro-in/s Vibration Design of Advanced Technology Facilities18Problem

16、 Definition:StructuresqMega fabs(usually 10,000+m2 CR)qSub-fabs(one-&two-level),stacked fabsqMostly concrete,mostly cast-in-placeqStructural isolation breaks(SIBs)qAccess floors vfrom 150mm to 1.7m vsecondary structures for sensitive toolsqSoil DynamicsVibration Design of Advanced Technology Facilit

17、ies19Problem Definition:Structures FPD q FPD Panel Size Driving Vibration Design Vibration Design of Advanced Technology Facilitiesv Newer Generations Larger Substrates Larger(Heavier)Tools Larger(Longer)FabsFabFabFab Footprint20Problem Definition:Structures FPD q FPD Panel Size Driving Vibration De

18、sign Vibration Design of Advanced Technology Facilitiesv Newer Generations Larger Substrates Larger(Heavier)AMHSsPotential Process Tool,AMHS Generated VibrationTraditional Vibration Requirements(VC Curves)21Problem Definition:Structures FPD q FPD Processes Driving Vibration Design Vibration Design o

19、f Advanced Technology Facilitiesv Differentiated Processes Different Functional Areas Different Vibration Criteria Multi-Level(Stacked)Fabs22Problem Definition:SensitivitiesqVC curvesvRMS velocity in 1/3 octave bandsv4 to 80 HzvThree directionsvBroadband random vibrationsvEnvironmental control tool

20、protectionqVC curves vs.process technologyqScanner dynamic stiffness requirementVibration Design of Advanced Technology Facilities23Generic Vibration Criterion CurvesGeneric Vibration Criterion(VC)Curvesfor vibration-sensitive equipment1001,00010,000100,000456.381012.516202531.540506380One-Third Oct

21、ave Band Center Freq.Hz RMS Velocity micro-in/sec VC-C 500min/s Workshop(ISO)32,000min/s Office(ISO)16,000min/s Operating Theater(ISO)4,000min/s Residential Day(ISO)8,000min/s VC-A 2,000min/s VC-B 1,000min/s VC-D 250min/s VC-E 125min/s Vibration Design of Advanced Technology Facilities24Workshop(ISO

22、)32,000 min/secN/AOffice(ISO)16,000 min/secN/AResidential Day(ISO)8,000 min/sec75 micronsOperating Theater(ISO)4,000 min/sec25 micronsVC A 2,000 min/sec8 micronsVC B 1,000 min/sec3 micronsVC C 500 min/sec1 micronVC D 250 min/sec0.3 micronsVC E 125 min/sec0.1 micronsCriterion CurveMax LevelDetail Siz

23、eGeneric Vibration Criterion CurvesVibration Design of Advanced Technology Facilities25Dynamics of Steppers and ScannersTimePositionVelocityAccelerationExposureScanner MotionTimePositionExposureVelocityAcccelerationStepper MotionVibration Design of Advanced Technology Facilities26Typical VC-D Floors

24、Vibration Design of Advanced Technology Facilities0.00010.0010.010.111101001000Frequency,HzReceptance,m mm/NTool A(Min)Tool BTool CFab AFab BFab CFab DFab E27Typical VC-E FloorsVibration Design of Advanced Technology Facilities0.00010.0010.010.111101001000Frequency,HzReceptance,m mm/NTool A(Min)Tool

25、 BTool CFab FFab GFab Z28Two Design FundamentalsControl of VibrationSourcesStructural/FoundationDesignVibration Design of Advanced Technology Facilities29Design Fundamentals:Structuresv 30+Hz for VC-D/VC-E floorsv Design for walker,mechanical excitationqVertical Designv Bending modes of fab baysv Fu

26、nction of bay sizes,waffle depth,etcDwLspanVibration Design of Advanced Technology Facilities30FEA Evaluation ExampleVibration Design of Advanced Technology Facilities31Local&Environmental Sources32Local&Environmental Sources33qHorizontal DesignDesign Fundamentals:Structuresv Potential for strong co

27、upling to soil modesv 3 6 Hzv Design for walker,mechanical excitationv Shearwall+floor diaphragm rigidityglobal structural modeVibration Design of Advanced Technology Facilities34Design Fundamentals:Structures Structural/Foundation DesignqSIBs vs.soilqPre-cast vs.cast-in-placeVibration Design of Adv

28、anced Technology Facilities35Design Fundamentals:Soil ConditionSoil Stiffness Small response to force inputs Inefficient propagation SIBs usually more effective Little to no“geometric”dampingBedrock Large response to force inputs Efficient distance propagation(typically low damping)SIBs usually less

29、 effectiveWeak SoilIdeal Soil Condition:Stiff to resist input,but with Good“geometric”dampingVibration Design of Advanced Technology Facilities36Design Fundamentals:Sourcesq Inspect isolation systems after installationq Use well-specified,well-balanced equipment(15240)Fc Ft q Specify good isolation

30、systems for equipmentF1F2 F1/10q Specify good isolation systems for piping,ductworkF1F2 F1/10Vibration Design of Advanced Technology Facilities37Precast Cross Girder38Precast Girder Section39Precast Top+Bottom Views40Precast-FRP41Precast-Rebar42Precast FRP Photo43Precast Form Photo44Precast Rebar Ph

31、oto45Noise Design of Advanced Facilities Interior Noiseq Interior noise criterionv NC-55 to-60 for CRv Lower limits in labs(TEMs,AFMs,etc.)v General occupancy limitsq CR Design RCU,FFU,fan towerNoise Design of Advanced Technology Facilities46Generic NC CurvesGeneric Noise Criterion(NC)Curves for Occ

32、upied Spaces and Other Critical Areas0102030405060708090631252505001k2k4k8kOctave Band Center Frequency Hz RMS SPL dB re:20 m mPa NC20 NC30 NC40 NC50 NC60 NC70 Noise Design of Advanced Technology Facilities47Noise Design of Advanced Facilities Environmental NoiseqCriterion:ordinance,or self-imposedq

33、3-D Computer modeling of facilityqMeasurements:property line monitoring,source dataNoise Design of Advanced Technology Facilities48Tool Hook-Up Major impact on Fab vibration Tool Pedestalsq Dynamic design(FEA)q Local compliancesq For scanners,resist internal forcesVibration Design of Advanced Technology Facilities