ASM-自动焊线机器介绍Au-wire-bonding-process课件.ppt

1、7-Dec-22 ASM Pacific Technology Ltd.2009 page 1Section 9.3 Basic Au Wire Bond Process7-Dec-22 ASM Pacific Technology Ltd.2009 page 2ContentsBasic IntroductionGold Wire BonderBonding SequenceMaterial&ToolsBond Quality7-Dec-22 ASM Pacific Technology Ltd.2009 page 3Basic IntroductionUnderstand an IC Pa

2、ckageIC Manufacturing FlowWire Bonding Introduction7-Dec-22 ASM Pacific Technology Ltd.2009 page 4Cross-section of an IC PackageDieGold WireLead Frame7-Dec-22 ASM Pacific Technology Ltd.2009 page 5Wafer GrindingDie BondingWafer SawToaster Wire Bonding Die Surface Coating Molding Laser MarkSolder Bal

3、lPlacement SingulationPackingIC Manufacturing FlowDejunk TrimSolder PlatingSolder PlatingForming/SingulationTrim/Forming BGASURFACEMOUNTPKGTHROUGHHOLE PKG7-Dec-22 ASM Pacific Technology Ltd.2009 page 6Gold Wire Bonding7-Dec-22 ASM Pacific Technology Ltd.2009 page 7Wedge Bonding7-Dec-22 ASM Pacific T

4、echnology Ltd.2009 page 8What technique is used in Gold Wire Bonding?7-Dec-22 ASM Pacific Technology Ltd.2009 page 9Wire Bonding TechniquesThere are three basic wire bonding techniques:Thermosonic bonding:utilizes temperature,ultrasonic and low impact force,and ball/wedge methods.Ultrasonic bonding:

5、utilizes ultrasonic and low impact force,and the wedge method only.Thermocompression bonding:utilizes temperature and high impact force,and the wedge method only.7-Dec-22 ASM Pacific Technology Ltd.2009 page 10Thermocompression vs ThermosonicThermocompression welding usually requires interfacial tem

6、perature of the order of 300C.This temperature can damage some die attach plastics,packaging materials,and laminates,as well as some sensitive chips.Thermosonic welding,the interface temperature can be much lower,typically between 100 to 150C,which avoids such problems.The ultrasonic energy helps di

7、sperse contaminates during the early part of the bonding cycle and helps complete the weld in combination with the thermal energy.7-Dec-22 ASM Pacific Technology Ltd.2009 page 11Advantages of ThermosonicMetallurgical joining is more reliable than conductive particles and adhesive joining.Process cyc

8、le time can be reduced from several minutes to less than 10 seconds.Lower manufacturing cost per unit.7-Dec-22 ASM Pacific Technology Ltd.2009 page 12Wirebonding Operating TemperatureWire MaterialsPad MaterialsNoteThermo-compression300-500 CAuAl,AuHigh pressure,no ultrasonic energyUltrasonic25 CAu,A

9、lAl,AuLow pressure in ultrasonic energyThermosonic100-240 CAu,CuAl,AuLow pressure in ultrasonic energyComparison of Different Wire Bonding Techniques7-Dec-22 ASM Pacific Technology Ltd.2009 page 13What are the important parameters in Gold Wire Bonding?7-Dec-22 ASM Pacific Technology Ltd.2009 page 14

10、Bonding ParametersThermosonic Bonding Pressure(Force)Amplify&Frequency(Power 138KHz)Welding Time(Bond Time)Welding Temperature(Heater)High Power3.2W maxLow Power1.6W maxUltra-Low Power0.8W maxPower-mWVib.-umPower-mWVib.-umPower-mWVib.-um32003.2116002.268001.597-Dec-22 ASM Pacific Technology Ltd.2009

11、 page 15SiO2Si Bonding PrincipleAlPressure(Force)Vibration(Power)Al2O3GlassHeat7-Dec-22 ASM Pacific Technology Ltd.2009 page 16Next to Gold Wire Bonder7-Dec-22 ASM Pacific Technology Ltd.2009 page 17Gold Wire BonderMachine RoadmapUnderstand Individual PartMachine SpecificationBonding Temperature7-De

12、c-22 ASM Pacific Technology Ltd.2009 page 18ASM Gold Wire Bonder RoadmapMachine Model(ATS)AB308AB309AB309AAB339AB339EagleEagle60 Eagle60AP Harrier Twin Eagle HummingBird Eagle50?7-Dec-22 ASM Pacific Technology Ltd.2009 page 19ASM Gold Wire Bonder Machine Model(ATS)Description7-Dec-22 ASM Pacific Tec

13、hnology Ltd.2009 page 20Matching1)Eagle60AP2)Eagle60-033)HummningBird4)Harrier5)Twin EagleA.B.C.D.E.ACEDB7-Dec-22 ASM Pacific Technology Ltd.2009 page 21Eagle60AP Machine Introduction7-Dec-22 ASM Pacific Technology Ltd.2009 page 22Eagle60 vs Eagle60APEagle60Eagle60APFine pitch 35 m.30 m.Speed 60+ms.

14、60 ms.BondheadDigital bondheadNew bondhead with 810%faster Bond Placement Accuracy 3 m 3 sigma 2.5 m 3 sigmaLoop TypesStandard looping databaseAdditional Escargot,Flex,Bell loopOpticsProgrammableBall Formation MonitoringStandard8x fasterCapacitance non-stick detectionStandard10 x faster7-Dec-22 ASM

15、Pacific Technology Ltd.2009 page 23uLow impact forceuReal time Bonding Force monitoringuHigh resolution z-axis position with 0.4 micron per encoder stepuFast contact detectionuSuppressed Force vibration&Fast Force responseuFast response voice coil wire clampBond Head ASSY7-Dec-22 ASM Pacific Technol

16、ogy Ltd.2009 page 24X Y TableuLinear MotoruHigh power AC Current AmplifieruDSP based control platformuHigh X-Y positioning accuracy of+/-3 um3 sigmauResolution of 0.2 um per encoder step7-Dec-22 ASM Pacific Technology Ltd.2009 page 25W/H ASSYIndexing resolution of 1um per encoder stepFully programma

17、ble indexer&tracksMotorized window clamp with soft close featureOutput indexer with leadframe jam protection featureTool less conversion window clamps and top plate enables fast device7-Dec-22 ASM Pacific Technology Ltd.2009 page 26Bonding SystemuBonding Method Thermosonic(TS)uBQM ModeMulti-mode wit

18、h programmable BQM BduWire Size15.2um up to 76.2um(Au,Cu)uWire Length0.6 to 8mmuBonding Accuracy+/-2.5um 3 sigmauBonding Area54mm X 65mm(LF Width 72mm)54mm X(137-LF Width)mmuBonding Speed+60ms for 2mm Wire(Q loop)uBond Force Range1400 gramuLoop TypeQ-Auto,Square&PentauLoop Height Range316 miluXY Res

19、olution 0.2 umuZ Resolution0.4 umuFine Pitch Capability30 um pitch 0.6 mil wireuNo.of Bonding Wiresup to 3000uProgram Storage1000 programs on Hard DiskuTransducer System138KHZ7-Dec-22 ASM Pacific Technology Ltd.2009 page 27Vision Systemu Pattern Recognition Time60 ms/pointu Pattern Recognition Accur

20、acy 0.37 umu Lead Locator Detection12 ms/lead u Minimum Lead Pitch80 umu Post Bond Inspection1st,2nd Bond and Wire Tracingu Depth of Field3.5X(320um)8X(100um)Facilitiesu Single Phase 110 VAC(optional 100/120/200/210/220/230/240 VACu Floor Spacing 720mm(width)X 820mm(length)X 1600mm(height)7-Dec-22 A

21、SM Pacific Technology Ltd.2009 page 28Material Handling SystemuIndexer Resolution1umuLeadframe Position Accuracy2 miluApplicable Leadframe W=23 90 mm bonding area in Y=65mm L =140 295 mm T =0.1 0.8 mmuApplicable Magazine W=16 100 mm(Maximum)L =140 295 mm H =180 mm(Maximum)uMagazine Pitch 2.4 10 mm(0

22、.09”0.39“)uDevice Changeover 4 minutes(within same LF type)uPackage Changeover 1000,490/100 4,8,1175%)7-Dec-22 ASM Pacific Technology Ltd.2009 page 123Inter-metallic Layer ThicknessX=Kt1/2Where X is the inter-metallic layer thickness,t is the time and K is the rate constant which is calculated by fo

23、llowing:K=Ce-E/KT Where C is the rate constant,e is the activation energy,K is the Boltzman constant,and T is the temperature in absolute scale.7-Dec-22 ASM Pacific Technology Ltd.2009 page 124CBall bondTest specimenSpecimen clampShearing ramWireBond shoulderInterfacial contactball bond weld areaBon

24、ding padh(A)UnshearedCLCBall bondCLTest specimenSpecimen clampBonding padFull ball attached to wire-except for regionsof intermetallic voidingBall separated at bonding pad-Ball interface-residual intermetallic(and sometimes portion of unalloyed ball and metal)on pad in bond interaction area(D)Ball b

25、ond-bonding pad interface separation(typical Au to Al)CTest specimenSpecimen clampShearing ramWireMinor fragment of ballattached to wireBonding padCLBall sheared too high(off line,etc.)only aportion of shoulder andball top removedInterfacial contactball bond weld area(B)Wire(ball top and/or side)she

26、arCBall bondCLTest specimenSpecimen clampShearing ramBonding padMajor portion of ball attached to wireInterfacial contact-ball bond weld area intact(C)Below center line shear,ball sheared through(typically Au to Au)CBall bondCLTest specimenSpecimen clampBonding padPad metallization separates fromund

27、erlying surfaceResidual pad on ball ball-pad interfaceremains intact(E)Bond pad liftsTest specimenSpecimen clampCBall bondCLBonding padBonding pad lifts,taking portion of underlying substrate material with it(F)CrateringResidual pad and substrate attachedto ball,ball-pad interface remainsintactShear

28、 Failure Modes7-Dec-22 ASM Pacific Technology Ltd.2009 page 125Normal Condition7-Dec-22 ASM Pacific Technology Ltd.2009 page 126Material Problem7-Dec-22 ASM Pacific Technology Ltd.2009 page 127With BallWirePad SizeMissing BallWire BrokenBonding Ball InspectionBall Detection 7-Dec-22 ASM Pacific Tech

29、nology Ltd.2009 page 128Ball Size Pad CenterBall CenterBall Placement(X,Y)Ball Off Pad Bonding Ball Inspection(cont.)Ball Measurement 7-Dec-22 ASM Pacific Technology Ltd.2009 page 129u Peeling1st Bond Fail(1)Power too muchBase Force not enoughAl pad not fully cured or contamination between Al and ox

30、ide layer7-Dec-22 ASM Pacific Technology Ltd.2009 page 130u Ball Lift1st Bond Fail(2)Ball LiftBall Lift With Pad PeelingBase Power not enoughMaterial problem 7-Dec-22 ASM Pacific Technology Ltd.2009 page 1311st Bond Fail(3)Neck CrackRD too highRH too lowWrong/over used capillaryWire Clamp gap too sm

31、allWire problemEFO Current too large 7-Dec-22 ASM Pacific Technology Ltd.2009 page 132Off Center BallTail Length too longWire or Wire Path contaminationEFO Box or cable connection problemAir Tensioner flow too low 1st Bond Fail(4)Off Center Ball(Golf Ball)7-Dec-22 ASM Pacific Technology Ltd.2009 pag

32、e 133u Smash BallTail Length too shortWire or E-torch contaminationTip of tail length swing away from E-torch Smash Ball7-Dec-22 ASM Pacific Technology Ltd.2009 page 134uMissing BallTail Length too shortFire Level too low or too highE-torch tip dirty2nd Bond Power/Force/Search Speed too high 7-Dec-2

33、2 ASM Pacific Technology Ltd.2009 page 135With WeldWireCapillary MarkMissing WeldBroken WedgeLeadSufficient Wedge Width&LengthSecure Tool ImpressionNo Fish TailNo Damage/Broken WedgeBonding Weld InspectionWeld Detection7-Dec-22 ASM Pacific Technology Ltd.2009 page 136Broken Wedge2nd Bond Power/Force

34、 too highLead clamping not enough2nd Bond Fail(1)Broken Wedge7-Dec-22 ASM Pacific Technology Ltd.2009 page 137Lead floating or contamination2nd bond time,power,force too smallOver used capillary2nd Bond Fail(2)Lift Stitch7-Dec-22 ASM Pacific Technology Ltd.2009 page 138Capillary Geometry2nd bond tim

35、e,power,force too smallOver used capillary2nd Bond Fail(3)Stitch Peeling7-Dec-22 ASM Pacific Technology Ltd.2009 page 139Wire ShortCapillary GeometryWire Path problemSecond Bond parametersAir Tensioner problem Looping Fail(Wire Short 1)Wire Sway7-Dec-22 ASM Pacific Technology Ltd.2009 page 140Wire S

36、hortCapillary GeometryWire Clamp Gap too bigTail BentAir Tensioner Force not enough Looping Fail(Wire Short 2)Loop Base Bent7-Dec-22 ASM Pacific Technology Ltd.2009 page 141Wire ShortCapillary GeometrySearch Delay setting not optimizedBase strength too weak,increase RD Looping Fail(Wire Short 3)Exce

37、ssive Loop7-Dec-22 ASM Pacific Technology Ltd.2009 page 142Floating leadsFriction along wire pathTrajectory selection is not goodWire on capillary is not good Looping Fail(Inconsistent)Inconsistent Looping7-Dec-22 ASM Pacific Technology Ltd.2009 page 143Critical Parameters for Bondingu Bond Paramete

38、r Contact Time、Power、Force(for 1st&2nd Bond)u Base Parameter Base Time、Power、Force(for 1st&2nd Bond)u Reference Parameter Search Height、Search Speed(for 1st&2nd Bond)u EFO Parameter Ball Size、FAB Size、EFO Time、EFO Current、EFO Voltage.u Looping Parameter R.H、R.D、Neck Angle、.7-Dec-22 ASM Pacific Techn

39、ology Ltd.2009 page 144Multi-tier Looping7-Dec-22 ASM Pacific Technology Ltd.2009 page 145Stacked DieDie Thickness 80umTotal Die Height 850um7-Dec-22 ASM Pacific Technology Ltd.2009 page 146Ultra Low LoopBell LoopEscargot LoopLoop HeightMinimum32 m.Maximum42 m.Mean37 m.Loop HeightMinimum40 m.Maximum

40、47 m.Mean44 m.7-Dec-22 ASM Pacific Technology Ltd.2009 page 147Short Wire LoopingDie edge to wire gap27.38 mmDie edge to 2nd bond pt.124.3 mm7-Dec-22 ASM Pacific Technology Ltd.2009 page 148J WireJ wire on 1st and 2nd kinkProvide better wire clearance and mold sweep especially for the corner wires7-

41、Dec-22 ASM Pacific Technology Ltd.2009 page 149BSOB/BBOS/Pump BallBond Stitch On BallBond Ball On Stitch7-Dec-22 ASM Pacific Technology Ltd.2009 page 150Bond Stitch On StitchSide View of 2nd BondTop View of 2nd BondTop View of Looping7-Dec-22 ASM Pacific Technology Ltd.2009 page 151Multi-Ball&Flex Bump BallTop View of Multi-BallSide View of Multi-BallFlex Bump Ball ShapeLooping for Flex Bump Ball7-Dec-22 ASM Pacific Technology Ltd.2009 page 152 END 感谢下感谢下载载感谢下感谢下载载