BGA返修和工作原理介绍课件.ppt

1、13.07.00.WVE.CA/kfPage 1IR.pptERSA GmbHBGA/SMD Rework CenterBGA/SMD Rework CenterERSA IR 500 A and PL 500 AERSA IR 500 A and PL 500 A13.07.00.WVE.CA/kfPage 2IR.pptERSA GmbHBGA Repair:BGA Repair:a better understanding can reduce fears,a better understanding can reduce fears,reduce costs,and guarantee

2、 process reduce costs,and guarantee process controlcontrol13.07.00.WVE.CA/kfPage 3IR.pptERSA GmbHDensity and performance requirementsDriving IC packing toward the size of the bare dieTrends in Flip Chip useThe Global Trend to Area Array PackagesThe Global Trend to Area Array Packages13.07.00.WVE.CA/

3、kfPage 4IR.pptERSA GmbHBGA,CSP,Flip Chip:Structural DesignsBGA,CSP,Flip Chip:Structural Designs13.07.00.WVE.CA/kfPage 5IR.pptERSA GmbHBGA Production-BGA Production-Collapsible and Non-collapsible Area Array PackagesCollapsible and Non-collapsible Area Array PackagesIn general,eutectic solder balls(S

4、n63Pb37)are always used for area array packages except in the case where the weight of the component is greater than the surface tension of the molten balls during reflow.A CBGA(ceramic BGA)is a typical example of a component that could not be“carried“by the surface tension of the solder balls durin

5、g the reflow process.In this case,a high melt ball,for example Pb90Sn10,is used because it will remain solid during the normal reflow process.Ball Comparison PhotosComparison of Installed PBGA to a CBGAThe above figures detail the different wetting zones,and wetting angles between a PBGA and CBGA an

6、d their respective joints.13.07.00.WVE.CA/kfPage 6IR.pptERSA GmbHThe Soldering Process-The Intermetallic Bond and itsThe Soldering Process-The Intermetallic Bond and itsRelation to Reflow TemperatureRelation to Reflow TemperatureThe heart of the solder jointSource:R.J.Kleinwassink,Soldering in the e

7、lectronicsA solder joint has two key purposes in the joining of two materials:1.An electrical connection2.A lasting mechanical connectionThe lasting mechanical connection can only be achieved when tin-lead(solder)is introduced to form a lasting intermetallic bond between the lead and land and both a

8、re heated to approx.30C above the melting point of solder.Scanning electron micrograph(SEM)of fractured intermetallic layers of a solder joint.Cu3Sn(e-phase)and Cu6Sn5(n-phase)make up the intermetallic layers.13.07.00.WVE.CA/kfPage 7IR.pptERSA GmbHTypical Reflow ProfilesTypical Reflow ProfilesInfrar

9、ed-soldering.Temperature/time-profile(lead-temperature).Full-line:typical process/dotted-line:process limitsTemperature-time curves obtained in a hot-air circulation oven.Source:R.J.Klein-WassinkReflow solder profile CECC 00 802:CECC Standard Method for the Specification of Surface Mounting Componen

10、ts(SMDs)of Assessed Quality.13.07.00.WVE.CA/kfPage 8IR.pptERSA GmbHA.BGA solder ball(Sn63PB37)placed on pad before reflow process begins.Stand-off height is,for example,1.0 mm(ball shape under component is perfectly spherical,surface is smooth and dull).B.Reflow process begins until melting point of

11、 solder ball is reached(183C),gravity acts on component and causes an initial or single drop:Stand-off height is 0.8 mm(ball shape is vertically elongated,surface is rough and matt).C.Peak temperature is reached in the reflow process allowing for complete and proper wetting of entire pad.A second or

12、 double drop occurs:stand-o f f h e i g h t i s 0.5 mm(ball shape is horizontally pressed or somewhat elliptical,surface is smooth and shiny).BGA Production-BGA Production-Typical Physical Effects during a Reflow ProcessTypical Physical Effects during a Reflow ProcessThe typical physical effects dur

13、ing the reflow process of a PBGA are graphically shown in the figures below with regards to the stand-off height and wetting angle.1 mmACondition ABefore Reflow BeginsB0.8 mmCondition BAt Solder Melt Point0.5 mmCCondition CAt Proper Peak Temperature13.07.00.WVE.CA/kfPage 9IR.pptERSA GmbHDouble Drop

14、Effect by BGA/CSP/Flip Chip(SnDouble Drop Effect by BGA/CSP/Flip Chip(Sn6363PbPb3737 Balls)Balls)1st Drop2nd DropGraphic depicts a non-solder mask defined(NSMD)padNote:Life cycle test results show that NSMD pad on both board and package give superior performance to when solder mask defined(SMD)pads

15、are used.Source:Reliability of BGA Packages in an Automotive Environment,Roger Rrgren,Per-Erik Tegehall and Per Carlsson,IVF-The Swedish Institute of Production Engineering Research,www.ivf.se13.07.00.WVE.CA/kfPage 10IR.pptERSA GmbHBGA Double Drop Effect Documented by Philips CFTBGA Double Drop Effe

16、ct Documented by Philips CFTSource:BGA Joint Formation,Jan Kolsters,Philips CFT,Eindhoven,Netherlands,May 2000Video clip of BGA joint formation revealing the double drop effect.The video was generated using the ERSASCOPE Inspection System.Click here to Click here to begin videobegin video13.07.00.WV

17、E.CA/kfPage 11IR.pptERSA GmbHA cross-section of a PBGA 225 after a proper reflow process reveals the complete wetting to the pad and the proper wetting angle of the flux residue.Cross-section of proper Double Drop PBGACross-section of proper Double Drop PBGACross-section of PBGA 225 after Soldering1

18、3.07.00.WVE.CA/kfPage 12IR.pptERSA GmbHBGA Self-Alignment EffectBGA Self-Alignment EffectThe self-alignment effect as the solder balls go into reflow13.07.00.WVE.CA/kfPage 13IR.pptERSA GmbHBGA Self-Alignment Effect Documented by Philips CFTBGA Self-Alignment Effect Documented by Philips CFTSource:BG

19、A Joint Formation,Jan Kolsters,Philips CFT,Eindhoven,Netherlands,May 2000Video clip of BGA joint formation revealing the self-alignment effect.The video was generated using the ERSASCOPE Inspection System.Click here to Click here to begin videobegin video13.07.00.WVE.CA/kfPage 14IR.pptERSA GmbHBGA R

20、epair:Hot Air Systems BGA Repair:Hot Air Systems 13.07.00.WVE.CA/kfPage 15IR.pptERSA GmbHBGA Repair:Hot Air vs.IRBGA Repair:Hot Air vs.IRHeat distribution across surface of BGA-convection and dark IR13.07.00.WVE.CA/kfPage 16IR.pptERSA GmbHTypical BGA Problems:X-ray InspectionTypical BGA Problems:X-r

21、ay InspectionDeformed balls,i.e.non-spherical Missing ball,solder bridging,Non-uniform solder quantity VoidsMisregistration13.07.00.WVE.CA/kfPage 17IR.pptERSA GmbHCBGA soldered to PCBX-ray image of CBGA after solderingERSASCOPE image of CBGA.Cracking zone is visibleX-ray image of PBGA 225:A A and B

22、B show mistakes but are unclear of sourceA.A.ERSASCOPE reveals flux residue bridge with conductive particlesB.B.ERSASCOPE shows incomplete solder melt of paste.B BA ATypical BGA Problems:Visual Inspection and X-ray combinedTypical BGA Problems:Visual Inspection and X-ray combined13.07.00.WVE.CA/kfPa

23、ge 18IR.pptERSA GmbHDark IR vs.light IR for PCB-reflow applicationsDark IR vs.light IR for PCB-reflow applicationsWavelength ranges of some radiation sources and their position in the spectrum of electromagnetic waves.The top and bottom ERSA dark IR radiators are medium wavelength(2-8 m),which has b

24、een proven to have the optimal absorption/reflection radio between light and dark colors.The component body,substrate,and leads are safely and evenly heated,thereby reducing any risk of damage during the reflow process.13.07.00.WVE.CA/kfPage 19IR.pptERSA GmbHERSA Dark IR BGA Repair:Uniform Heat Dist

25、ribution ERSA Dark IR BGA Repair:Uniform Heat Distribution Heat distribution across surface of BGA 16913.07.00.WVE.CA/kfPage 20IR.pptERSA GmbHBGA Repair:Production like results with IR 500ABGA Repair:Production like results with IR 500ASource:Fraunhofer Institut ISIT,Itzehoe,Germany13.07.00.WVE.CA/k

26、fPage 21IR.pptERSA GmbHRework Equipment Purchase Decision Flow Chart Rework Equipment Purchase Decision Flow Chart 1.Quality-Results O.K.?2.2.Repeatability Repeatability-User-Friendly?-User-Friendly?3.3.FlexibilityFlexibility-Chips,Plastic,BGA,PTH,.?-Chips,Plastic,BGA,PTH,.?-Initial Investment?-Cycl

27、e Time?-Nozzles,etc.?-Spare Parts,e.g.heaters?4.4.Return on InvestReturn on Invest -Operational Costs -Operational Costs?13.07.00.WVE.CA/kfPage 22IR.pptERSA GmbH13.07.00.WVE.CA/kfPage 23IR.pptERSA GmbHPL 500 A:Optical BGA/SMD Placement SystemPL 500 A:Optical BGA/SMD Placement SystemMotorized Z-axis,

28、Motorized Z-axis,Zoom,and FocusZoom,and FocusSplit OpticsSplit OpticsAuto ZoomAuto ZoomPre-setsPre-setsAuto Vac Auto Vac Pick-n-PlacePick-n-PlaceTwo Camera Inputs/Two Camera Inputs/Auto SwitchAuto SwitchStand alone or fully Stand alone or fully integratedintegrated13.07.00.WVE.CA/kfPage 24IR.pptERSA

29、 GmbHBGA,CSP,Flip Chip Precision Placement and ReflowBGA,CSP,Flip Chip Precision Placement and Reflow13.07.00.WVE.CA/kfPage 25IR.pptERSA GmbHERSA IR 500 A International Users ListERSA IR 500 A International Users ListABB ADIAGFAAIRSYS NavigationArab Britisch Dynamics Co.ASG LuftfahrttechnikBertelsma

30、nnBlaupunktBORAQBoschBritish AerospaceCellstarCOMPAQComtechData-FaxDIALOG SemiconductorDigitron da AmazoniaEFACECEFORE OyEIA-Electronica AvionicosELABO GmbHEricsson ComponentsEricsson Radio SystemsFAST LinkFischer ElektronmechanikFraunhofer InstitutGallyas S.A.GLOBAL NETGrundigHCL Heidelberger Druck

31、maschinenI.S.T.-InstitutoIBMInstitute of Complex SystemsJastel,Lda.Jutron OyKhimji RamdasLacomLang GmbHLasat GmbHLeicaLibannetMatsushitaMax-Planck-InstitutMetzMicronasMilitary Research InstituteMotorolaMSL TechnologyNanJingNational Telecom InstituteNetas A.S.NintendoNISDOMNokia Mobile PhonesPCB-Serv

32、icePetri AGPhilipsQuantumRoal Electronics SRLRobert BoschSAMCOSamsungSCESSchlafhorstSiemens AGSolectron TechnologySymbol TechnologiesSystel Technical Research InstituteTelecom Italia MobileTeleste OyTelitalTellabs OyTEMIC Telefunken/LuftfahrtTexas InstrumentsToyoda AutomaticTritec GmbHTreutschler GmbHUnger AutotechnikUniversitt BremenUnlimited ComputerUTS-Universal TechnikVega GrieshaberWaltron GmbHWestland HelicoptersZVE1800 installations to date1800 installations to date