-西门子可靠性培训课件.ppt
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1、6,000,008,00M.Chbat,S.Eberlin,M.Tochtermann,T.JuhnkehiT 7500 Multi-Haul DWDM system Product Reliability Update Processes,Status,and MeasuresSept 15,2019Information and Communication Networks6,000,008,00Siemens Reliability Process OverviewOptical Components:EDFA VOA GTC PassivesNegotiations with supp
2、liers:Modeling Field experience Supplier comparisonElectrical Components:Resistors Capacitors Transistors ICs etc.Standards:SN 29500 IEC 61709Mechanical Components:Connectors Boards etc.Standards:SN 29500 IEC 61709Card FIT Rate Feedback from Field Return RateInformation and Communication Networks6,0
3、00,008,00Product Reliability Assurance ProcessReference:Siemens standard;in agreement with international standards IEC 61709product definitionproduct developmentproduct deliveredrequirements aligned with technology basis failure rate allocation to individual cards involvement of component engineerin
4、g&QAcard failure rates on basis of parts listscomponent rating by designnew&critical components specificationnew components&supplier auditsin production failure controlfield return analysis&threshold monitoringconservative data based on predicted valuesregular component supplier auditsInformation an
5、d Communication Networks6,000,008,00Reliability Control and ImprovementCross-functional team established to install focused program Close interaction with the supplier for design,technology and processEarly failure monitoring and feedback in development phase Extended testing including temperature c
6、ycling in productionDetailed failure monitoring in production for early corrective actionInformation and Communication Networks6,000,008,00Predicted FIT rates vs.field return FIT ratesField return FIT rate inherently is(!)lower than predicted FIT rate nspare parts dont contribute to FMAnnon-installe
7、d equipment at certain carriersnlow channel count for many yearsntemperature for FIT estimation probably higher than in realitynmargin(e.g.,due to low channel count,low PMD,BOL)can mask performance degradationInformation and Communication Networks6,000,008,00Functional Partition of OLIOptical amplif
8、ication via EDFA gain blocknPump diodesnMonitor diodesnEDF-HeaternInternal Gain SwitchOSC splitting functions asnAdd/Drop of the OSC channel using wavelength selective couplersnSplitting of monitor signals at the input and output port and at intermediate measurement pointsSpectral shaping of the sig
9、nal using anVOA for setting the EDFA to an optimized operating pointnGTC for tilt compensationOptical monitor ports at input and output for signal supervisionAPSD circuitryGain Control and Supervision(DSP,on-board processor)Electrical components for control and power supplyMechanics including PCBInf
10、ormation and Communication Networks6,000,008,000 1 2 3 4 5 6 7 8 9 10 11 12 13 Operating time T in yearsFailure rate l l Early failuresl l totalWear-out failureThe bathtub curve:Failure rates l l via time TRandom failureFor the field replaceable HW-units and their componentsthe failure rate l l coul
11、d be only predicted by random failures!The unit of the failure rate l l is a FIT(Failure in Time;1 FIT=1 Failure per 109h)!Bathtub CurveInformation and Communication Networks6,000,008,00IEC 61709:Electronic components ReliabilityReference conditions for failure rates and stress models for conversion
12、(no basic failure rates)Relationship between StandardsSIEMENS standard SN29500/IEC 61709 compared to SR-332SR-332:Reliability Prediction Procedure forElectronic EquipmentSN29500:Failure rates of componentsExpected values(This is in addition to IEC 61709)a)Climatic and mechanical stresses per IEC 721
13、-3-3(see next slide)multiplying factors for environmentalconditionsb)Quality factortested components SN725004 quality levels knownc)Temperature and electrical stressby reference conditions IEC 61709given reference conditions and conversion(SR-332)Information and Communication Networks6,000,008,00IEC
14、 61709:Electronic components Reliability Reference conditions for failure rates and stress models for conversionThe failure rate under operating conditions is calculated as follows:TIUfRe l l l lWherel lref is the failure rate under reference conditions;U is the voltage dependence factor;I is the cu
15、rrent dependence factor;T is the temperature dependence factor.These Parameter are listed e.g in the SN29000 library!Reference conditions for climatic and mechanical stressesType of stressReference condition 1)q qamb,ref=40 CClimatic conditionsClass 3K3 as per IEC 721-3-3Mechanical stressClass 3M3 a
16、s per IEC 721-3-3Special stresses 3)NoneFor details of notes(-1,-2,-3)please refer to IEC 61709Ambient temperature 2)The definitions,reference conditions and conversion models used in the IEC 61709 fullycorrespond with the already existing SIEMENS standard SN 29500 method.Details:SIEMENS Standard SN
17、29500 and IEC 61709Information and Communication Networks6,000,008,00FIT Rates of Individual Electrical Components(1)Voltage dependence and Current dependence UC UUeCrefC()122 UCUUUUeCrefC()()maxmax322(1)(2)UOperating voltage in VUrefReference voltage in VUmaxRated voltage in VC1Constant in(1/V)C2C2
18、,C3Constants(1).Digital CMOS Families,Contactors (2).Others ICIIIIeCrefC()()maxmax455IOperating current in AIrefReference current in AImaxRated current in AC4,C5ConstantsInformation and Communication Networks6,000,008,00FIT Rates of Individual Electrical Components(2)AConstantEa1,Ea2Activation energ
19、ies in eVTU,refReference ambient temperature in KT1Reference junction*)-(comp.*)-)temperature in KT2Actual junction*)-(comp.*)-)temperature in K*)Depends on type of component,see also SN 29500,Part 1,Capt.4.3 TEa zEazEa zEazA e+(1-A)eA e+(1-A)e121ref2refwithinin z11605(1T1T)1eVz11605(1T1T)1eVU2refU1
20、refrefandTemperature dependenceInformation and Communication Networks6,000,008,00The expected failure rate of a HW-unit can be calculatedby adding the expected failure rates of the components:l l l ljjComponentUnitEPROMCapa.Resi.FanTrans.DiodeDC/DCOptic.ModuleICPINsLEDSolder jointsASICfield-replacea
21、ble HW-unit(Example)EPROMOptic.ModulePINsLEDICICICTrans.DiodeDiodeTrans.Trans.FanCapa.Capa.Capa.Capa.Capa.Resi.Resi.Resi.Resi.Resi.Resi.Resi.ASICResistors1 FIT8168 FITCapacitors2 FIT61212 FITDiodes8 FIT3624 FITTransistors15 FIT41260 FITICs25 FIT464100 FITEPROM100 FIT264200 FITDC/DC40 FIT22880 FITASI
22、C250 FIT21016500 FITFAN150 FIT210300 FITOptical Module800 FIT2321.600 FITSolder joints0,1 FIT1260126 FIT3.010 FITFailure rates ofl l ComponentsSum offailure ratesName ofComponentsNo.ofPinsNo.ofComp.Example:tot.failure rate of the HW-unit l l unit=Component 1R1 1,l,l1Component 2R2 2,l,l2Total functio
23、nal reliability(survivor)Rtot of two components:tttt21tottot2121eeee(t)R(t)R(t)R l l l l l l l l l l Details:Total Reliability and Total Failure Rate of UnitInformation and Communication Networks6,000,008,00Siemens Reliability Process OverviewOptical Components:EDFA VOA GTC PassivesNegotiations with
24、 suppliers:Modelling Field experience Supplier comparisonElectrical Components:Resistors Capacitors Transistors ICs etc.Standards:SN 29500 IEC 61709Mechanical Components:Connectors Boards etc.Standards:SN 29500 IEC 61709Card FIT Rate Feedback from Field Return RateInformation and Communication Netwo
25、rks6,000,008,00Estimation of FIT Rates for Optical ComponentsIn parallel to the qualification cross-check detailed discussions take place with the vendorWhat is the estimate of the vendor?How did he reach his estimate?What is the FIT rate of sub-components and PCBAs of the module?Results of the cros
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