SMT-技术介绍课件.pptx
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- SMT 技术 介绍 课件
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1、Surface Mount Technology Introduction表面贴装技术简介Definition/定义2SMT-Surface Mounting Technology:SMT is a process or assembly technique by which components are soldered onto the board surface./SMT 是把零件焊接到印刷线路板表面的 工艺或装配技术.Learning Objective3 General Process Engineering Introduction/一般的工艺流程介绍一般的工艺流程介绍 SMT v
2、s THT/表面贴装技术表面贴装技术 vs 通孔装配通孔装配技术技术Composition/组成组成Assembly Classifications/装配分类装配分类Advantages/优点优点Development Trend /发展趋势发展趋势SMT defect & Countermeasure /SMT 不良不良及改善对策及改善对策 Process flow/工艺流程图工艺流程图4PrintingPaste InspectionPlacement Reflow solder Clearing PCB FA Function TestPacking FQA InspectionShip
3、pingOKNGVisual InspectionICT TESTPCBA FUNCTION TESTBox BuildingReworkNGNGOKOKNGOKVisual InspectionAOT testHand loadingWave solderOKReworkOKNGNGOKPCBA Process Flow Chart/SMT工艺流程图SMT Equipment Overview/ SMT 设备纵览5Surface Mounting TechnologyPrinterP&PP&PReflow OvenAOIQuality control point Quality contro
4、l point Process Flow/工艺流程Flow ChartGeneric Process Flow / 一般的工艺流程图Process Description:过程描述Key Parameter:关键参数 Responsibility: 责任Receiving Material / 收料Part Number and QuantityStoreProcess Description:过程描述Key Parameter:关键参数 Responsibility: 责任Incoming Inspection / 来料检查Inspection on IncomingIQC6Process
5、Flow/工艺流程Flow ChartGeneric Process Flow / 一般的工艺流程图Process Description:过程描述Key Parameter:关键参数 Responsibility: 责任Storage and Material Kiting / 物料存放Part Number, Work Order Quantity, FIFO,WIPStores Process Description: Label Application and board tracking / 贴标签板的跟踪过程描述Key Parameter:关键参数 Responsibility:
6、责任Label Verification and Correct Kit Release on NetworkMBU/制造部门7Process Flow/工艺流程Flow ChartGeneric Process Flow / 一般的工艺流程图Process Description:过程描述Key Parameter: Screen Printing / 丝印Stencil selection, Supporting jig, Paste Height, Machine Parameters, Stencil cleaning, Solder Paste Usability Responsib
7、ility: IPQC,Eng.,MBU,StoresProcess Description:过程描述Key Parameter:关键参数 Responsibility: 责任 Pick and Place (surface mounting)表面贴装BOM, Loading List, LayoutQA,Eng., MBU制造部8Process Flow/工艺流程Flow ChartGeneric Process Flow / 一般的工艺流程图Process Description:过程描述Key Parameter:关键参数 Responsibility: 责任Reflow / 回流Tem
8、perature Profile to Match Specific ProductEng.Process Description:Post Reflow Inspection /回流后检查过程描述Key Parameter:关键参数Responsibility:IPC-A-610, Customer BOMMBU9Process Flow/工艺流程Flow ChartGeneric Process Flow / 一般的工艺流程图Process Description:过程描述Key Parameter:Hand Insertion (PTH )/ 手插件Hand Insertion of C
9、omponents as per instruction / layout关键参数 Responsibility: 责任MBUProcess Description:过程描述Key Parameter:Wave soldering / 波峰焊接Temperature Profile , Flux, Solder bar, Wave pallet,关键参数 Responsibility: 责任Eng.10Process Flow/工艺流程Generic Process Flow / 一般的工艺流程图Process Description:过程描述Key Parameter:关键参数 Respon
10、sibility: 责任De-panelize of PCB / 分板Tab Removal and PCB De-panelizeMBUProcess Description: Visual Inspection and Date Collection / 目检和系统跟踪过程描述Key Parameter: 关键参数 Responsibility: 责任IPC-A-610D, layoutMBU11Process Flow/工艺流程Flow ChartGeneric Process Flow / 一般的工艺流程图Process Description:过程描述Key Parameter:关键
11、参数 Responsibility: 责任Screwing / 打螺丝Torque / screw tipMBU / Eng.Process Description:过程描述Key Parameter:关键参数Responsibility:责任In Circuit Test / 在路测试Test PCB Assembly Circuitry/测试PCB装配线 路MBU12Process Flow/工艺流程Flow ChartGeneric Process Flow / 一般的工艺流程图Process Description:过程描述Key Parameter:关键参数Responsibilit
12、y:责任Manual Assy / 装配Fixture / Critical inspection card /夹具/鉴定检 查卡片MBU, Eng.Process Description:过程描述Key Parameter:关键参数 Responsibility: 责任Functional Test / 功能测试Functional Test or E-Prom Flash/功能测试MBU, Testing13Process Flow/工艺流程Flow ChartGeneric Process Flow / 一般的工艺流程图Process Description:过程描述Key Parame
13、ter:关键参数 Responsibility: 责任Reliability Test / 可靠性测试Cyclical Reliability Test/循环可靠性测试OQAProcess Description:过程描述Key Parameter:关键参数 Responsibility: 责任Final Inspection / 最后检查IPC-A-610DMBU14Process Flow/工艺流程Flow ChartGeneric Process Flow / 一般的工艺流程图Process Description:过程描述Key Parameter:Label Printing / 标
14、签打印Programming / Label Printing and Serial# tracking /设计/打印标签和S/N的跟综关键参数 Responsibility: 责任Eng. , MBUProcess Description: Label Application and Packing / 贴标签和包 装过程描述Key Parameter:Apply Label to PCB and Pack with Correct User Documents/根据使用文件申请PCB和包 装的标签关键参数Responsibility:MBU责任15Process Flow/工艺流程Flow
15、 Chart/流程图Process Description:Post Pack Audit (PPA) / 封箱前检查 过程描述Key Parameter:Visual Audit on Workmanship,Labeling, Packaging,User Document Contents and Electrical Audit/目检技艺,标签,包装,使用文 件内容及有关电的审查.OQA关键参数 Responsibility: 责任Process Description:过程描述Key Parameter:Palletization and Shipping / 打包和出货Confor
16、mance to Customer Packaging Instructions/与消费者的包装只是一致关键参数 Responsibility: 责任MBU,OQAGeneric Process Flow / 一般的工艺流程图16Equipment introduction/设备介绍Screen PrintingChip PlacementQFP /BGA Placement SMT / 表面贴装技术Solder paste inspection 17Equipment introduction/设备介绍Reflow OvenWave Soldering18Equipment introduc
17、tion/设备介绍Depanelization machine / 分板机Router R-168Punching machineV-cut19Equipment introduction/设备介绍Programming & Functional TestIn Circuit TestInspection equipment / 检查设备X-ray5DXTesting equipment / 测试设备AOI20Equipment introduction/设备介绍Other equipment / 其他设备Underfill MachineBaking Oven21BGA Rework sta
18、tionSMT vs THT/表面贴装技术 vs 通孔装配技术THT stands for “Through Hole Technology”.THT components has long leads and are insert mounted through the printed circuit board. The solder joints are formed using wave soldering technology./通空元件有长的元件脚,装配时将长脚插入并穿透印刷线路 板,通过波峰焊接技术形成焊点.SMT components have no or short lead
19、s. They are mounted on the surface of the printed circuit board. The solder joints are formed using both wave soldering or reflow soldering technology表面贴装元件没有或者只有很短的元件脚,元件被贴装到印刷线路板的 表面,通过波峰焊接或者回流焊接技术形成焊点22SMT vs THT/表面贴装技术 vs 通孔装配技术23Comp Type元件类型Board Type板的类型Assembly Method装配方式Soldering Technology
20、T HT通孔技术60S80S年代Single/Double side PCB单面/双面PCBManual/Semi-auto insertion手动/半自动插件Manual soldering手工焊接70S 90S年代Single Line/ Dual In Line/ AxialSingle side/ Multiple layer PCB 单面/多层PCBManual/ Semi-auto/Auto Insertion手动/半自动/自动插件Wave soldering/ Manual soldering 波峰焊接/手工焊接SMT表面 贴装技术80S Now现在SMD, Chips, LSI
21、, VLSIHigh Density Board 高密度板Fully Automatic全自动Wave soldering/ Reflow soldering 波峰焊接/回流焊接Composition of SMT/SMT 组成24SMT is comprised of/表面贴装技术组成 Material /原料-Components/元件-Printed Circuit Board/印刷线路板-Adhesives, Solder paste, Cleaning solvents/粘胶,锡膏,清洗容剂Process 工艺-Glue dispensing/点胶-Printing/丝网印刷-Wav
22、e/Reflow soldering/波峰焊/回流焊-Inspection/Testing/检查/测试Composition of SMT/SMT 组成25SMT is comprised of/表面贴装技术组成Equipment /设备-Dispenser/点胶机-Solder paste Printer/丝网印刷机-SPI/锡膏检测-Placement/贴片机-Soldering/焊接设备-AOI/自动光学检测-In-Circuit-Test/Functional Test/ICT在线测试设备/功能测试设备Classification by Soldering Method/按焊接方式分类
23、:a. Reflow Soldering Most commonly used method./回流焊接-最常用的方法.Solder Paste Printing锡膏印刷26Component Placement元件贴装Reflow Soldering回流焊接SMT Assembly classifications/SMT装配分类SMT Assembly classifications/SMT装配分类b. Wave Soldering Method/波峰焊接方法Sufficient glue is first applied to hold the SMT component in place
24、 without interfering with other parts of the board by printing or dispensing. When the component has been placed, the glue is cured to make the bond firm. This is done by either applying heat or ultra violet radiation (UV). The THT components are inserted through the PCB and the entire board enters
25、the wave soldering machine.通过印刷或点胶在不影响板上其他部件的前提下,用足够的胶水固定表面贴 装元件在相应位置,当元件贴装完成之后,通过加热或红外线辐射将胶粘点固 化,在插上通孔元件之后,让整个板通过波峰炉进行焊接Glue Application点胶SMT component Placement SMT元件贴装Glue Curing胶水固化THT component Insertion通孔元件插装Wave Soldering波峰焊接27SMT Assembly Classifications/SMT装配分类Classification by assembly typ
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