SOP封装工艺流程介绍-ppt课件.ppt

1、ConfidentialConfidential1.Package Instruction2.Process Flow3.Quality ControlConfidential1. SOP2. SSOP3. TSSOP4. MFPASEASEConfidentialConfidentialASY process flow前段制程前段制程后段制程后段制程WaferDie (chip)Die on Lead frameEpoxyLead FrameBeforeAfterLaser MarkingLaser MarkingLaser MarkingLaser MarkingConfidentialL

2、OADUNLOADGRINGINGPurpose:Grinding the wafer to Customer required thickness晶圓 (未研磨)研磨機晶圓 (研磨後) Confidential晶元背面Wafer backsideFrameMount TapePurpose: Combine the wafer with Dicing tape onto the frame for die sawingWafer mount MachineFrameConfidentialPurpose: To separate dies from each other for die at

3、tachMonitorLoad/UnloadSawingCleaningMachineConfidentialConfidentialPurpose:Attach the dies with epoxy on substrate for the following processOutputDie bondSubstrate load bondConfidentialWorking flow:Robber tipLead-frameEpoxyConfidentialPurpose: Solidify the epoxy after D/AInsideOvenConfidentialPurpos

4、e: Connecting the chip and the exterior circuitinputinputoutputBond locationTheory: Use ultrasonic, thermal, force to form the intermetallic between golden wire and joint metal (Al, Au, Ag)Gold wireleadDieAl padCapillaryConfidentialMold MachinePurpose: Seal the product with EMC to prevent die, gold

5、wire from being damaged, contaminated and oxygenic.ConfidentialMoldingTop chaseAir vent Bottom chase Cavity Leadframe Plunger PotGate insertRunner CompoundBottom cull blockTop cull blockConfidentialMoldingTop chaseAir vent Bottom chase Cavity Leadframe PotGate insertRunner CompoundBottom cull blockT

6、op cull blockPlunger ConfidentialMoldingTop chaseAir vent Bottom chase Cavity Leadframe PotGate insertRunner CompoundBottom cull blockTop cull blockPlunger ConfidentialAfter MoldMoldingTop chaseAir vent Bottom chase Cavity Leadframe PotGate insertRunner CompoundBottom cull blockTop cull blockPlunger

7、 EpoxyLead FrameConfidentialPurpose： Use laser light irradiated by CO2 or YAG to vapour the EMC to show content on the package，such as date, schedule, place of production and so on.laserEMC vapouredBeforeAfterLaser markingConfidentialOvenInsidePurpose: To let EMC react completely so that products ca

8、n be protected more effectively.ConfidentialPurpose： Remove the dem-bar of leadframe.Working areaBeforeAfterLaser MarkingLaser MarkingConfidentialPurpose: To plating Sn on the lead which will mount on board pad.loadunloadPlating lineConfidentialAfterBefore投料區電解去膠高壓噴洗酸洗收料區活化槽電鍍槽中和槽熱D. I.水烘 乾 SOLDER P

9、LATING (S/P 區)ELECTRO DEFLASH (E/D區 )面板操作ConfidentialPurpose: Remove the tie-bar and lead-frame and form products to units from strips, fill them into tubes and then pass to next process.Saw work areaunloadWorking areaunloadLaser markingConfidentialWorking areaLaser markingunloadunloadLead CutFormin

10、gConfidentialDie Saw切偏切偏Chipping外观检查外观检查划片宽度量测划片宽度量测RejRejConfidentialLead FrameEpoxyDieDie ShearEpoxy Void CheckDie AttachConfidentialEpoxy Thickness & Fillet HeightDie AttachDie LocationRejConfidentialWire Bond外观检查外观检查第二焊点重叠第二焊点重叠RejRejRejRej第二焊点偏移第二焊点偏移线弧不良线弧不良RejRejConfidentialDie推球测试推球测试拉力测试拉力测

11、试Wire BondConfidentialWire Bond验证级工程确认验证级工程确认IMC CoverageIMC ThicknessCrater Test1st bond1st bond2nd bondLoopingConfidentialMoldLooping外观检查外观检查上下错位上下错位孔洞孔洞缺角缺角溢胶溢胶内部气泡内部气泡冲线值量测冲线值量测RejRejRejRejRejConfidentialPlating外观检查外观检查Solderability test镀层厚度量测镀层厚度量测170C烘烤烘烤8小时，小时，9095C蒸汽老化蒸汽老化10小小时。锡覆盖率时。锡覆盖率95%RejRejRejConfidentialTirm/Form毛刺毛刺脚偏脚偏漏底材漏底材长短脚长短脚脚弯脚弯异物附着异物附着外观检查外观检查外形尺寸量测外形尺寸量测超声波扫描超声波扫描RejRejRejRejRejRej