IC基础知识ppt课件.pptx

1、IC基础知识基础知识一、主被动元器件的定义二、主动元器件的分类目录被动元器件（被动元器件（Passive Components) 又叫无源器件，相对於主动元件来说的，是指不影响信号基本特徵，而仅令讯号通过而未加以更动的电路元件。 最常见的有电阻、电容、电感、变压器等。主动原主动原器器件（件（Active Components） 又叫有源器件，一般用来信号放大、变换等，无源器件用来进行信号传输，或者通过方向性进行“信号放大”。能控制电压或电流，或在电路中创造转换的动作-。二极管、三极管、IC、晶振、传感器都是有源的。一、主被动元器件的定义Electronic component电子元件：电子元件

2、： Passive component被动元件 Active component主动元件 Electromagnetic component电磁元件Electromechanical component机电元件 Electro-optic component光电元件 Printed board印制电路板 Wire and cable线材Component Family 元器件族系Active components主动主动元件：元件： Discrete semiconductor分立半导体 IC集成电路 Hybrid IC混合集成电路 Active oscillator有源振荡器Active c

3、omponents sub-family主动元件子族系Discrete semiconductor分立分立半导体：半导体： Diode二极管 Transistor晶体管 Thyristor晶闸管Discrete semiconductor group分立半导体分类Diode二极管二极管Diode can be classified by various type基于不同基于不同的分类方式，二极管有不同的的分类方式，二极管有不同的分类：分类：Classification by working frequency根据工作频率分类 Classification by structure根据结构分类

4、Classification by forward current根据正向额定电流分类 Classification by integratability根据集成度分类 Classification by shape根据组装工艺分类Discrete semiconductor group分立半导体分类 Diode二极管Classification by working frequency根据工作频率可分为High-frequency band 高频波段 General purpose frequency band普通波段(f=1MHz)Discrete semiconductor group分

5、立半导体分类 Diode二极管Classification by structure根据结构可分为Planar diode平面型二极管 Mesa diode台面型二极管Discrete semiconductor group分立半导体分类 Diode二极管Classification by forward current根据正向额定电流可分为Small-signal diode小信号二极管（=1A）Discrete semiconductor group分立半导体分类 Diode二极管 Classification by integratability根据集成度可分为Discrete type

6、 diode分立二极管 Diode arrays二极管阵列Discrete semiconductor group分立半导体分类 Diode二极管 Classification by shape根据组装工艺可分为 THT diode通孔型二极管 SMT diode贴片型二极管Discrete semiconductor group分立半导体分类 Diode二极管 Diode I-V characteristic二极管伏安特性 Rectifier diode整流二极管 Zener diode稳压二极管 Switch diode开关二极管Diode二极管Diode polarity二极管是极性元件

7、 Marking is cathode负极标识 No marking for bi-directional双向TVS管无极性标识Diode二极管 Rectify diode整流二极管 Unilateral conductivity二极管的单向导电性Diode二极管 Switch diode开关二极管 Switch characteristics二极管的开关特性Diode二极管 Zener diode稳压二极管 Zener diode reverse characteristic稳压二极管的反向特性Diode二极管 Transistor can be classified by various

8、type根据不同的分类方式，晶体管可分为 Classification by construction根据结构分类 Classification by power dissipation根据功耗分类 Classification by integratability根据集成度分类 Classification by shape根据组装工艺分类Discrete semiconductor group分立半导体分类 Transistor晶体管 Classification by construction根椐构造可分为 Bipolar transistor双极性晶体管（三极管） Unipolar t

9、ransistor/Field effect transistor单极性晶体管（即FET场效应管）Transistor晶体管 Classification by power dissipation根据功耗可分为Small-signal transistor小信号晶体管（=1W）Transistor晶体管 Classification by integratability根据集成度可分为Discrete type transistor 分立晶体管 Composite transistor合成晶体管 *digital transistor is BRT, this is transistor wi

10、th built-in resistorTransistor晶体管 Classification by shape根据组装工艺可分为 THT transistor通孔型晶体管 SMT transistor贴片型晶体管Transistor晶体管 Bipolar transistor/Transistor双极性晶体管即三极管PNP transistor PNP型三极管 NPN transistor NPN型三极管Bipolar transistor/Transistor双极性晶体管 Transistor pin-out三极管的脚位For TO-92 and SOT-23, pin-out is g

11、enerally defined with A figure对于TO-92和SOT-23封装的三极管脚位通常如右 图所示 Various pin-out for various items不同的型号有不同的脚位 NPN Transistor I-V characteristic NPN型三极管伏安特性 Unipolar transistor/Field effect transistor单极性晶体管（即FET场效应管） N channel JFET N通道J型场效应管 P channel JFET P通道J型场效应管 N channel MOSFET N通道MOS型场效应管 P channel

12、 MOSFET P通道MOS型场效应管 FET pin-out场效应管的脚位Various pin-out for various items不同的型号有不同的脚位 N channel JFET characteristic curve N通道J型场效应管特性曲线 P channel JFET characteristic curve P通道J型场效应管特性曲线 N channel MOSFET characteristic curve N通道MOS型场效应管特性曲线 P channel MOSFET characteristic curve P通道MOS型场效应管特性曲线 Thyristor

13、晶闸管 SCR/Silicon controlled rectifier单向可控硅 TRIAC/BCR双向可控硅 DIAC双向触发二极管 PUT可编程单结晶体管Thyritor晶闸管 SCR单向可控硅Thyritor晶闸管 BCR双向可控硅Thyritor晶闸管 DIAC双向触发二极管Thyritor晶闸管 PUT可编程单结晶体管Thyritor晶闸管 IC集成电路 Classification by package根据封装形式可分为 Single package Dual package Quad package BGA package CSP/chip scale package Clas

14、sification by construction根据制造工艺可分为 Analog & mixed signal模拟与混合信号IC Digital logic数字逻辑ICIC group集成电路分类 Analog & mixed Signal模拟与混合信号 ICADC/DAC模数/数模转换IC Audio & Modem音频/调制IC Controller控制IC OP amp运算放大器 Opto-coupler光耦 Power converter电源变换IC Switch analog模拟开关IC Video interface视频接口IC Voltage reference电压参考IC

15、Voltage regulator电压调整IC RF射频ICIC集成电路 Digital logic数字逻辑IC分为： Standard logic标准逻辑IC Programmable logic可编程逻辑IC Memory存贮器 Processor处理器 Specialized IC专用IC LAN/WAN/Interface局域网/广域网/接口IC Bus总线IC Classification by function根据用途可分为 General purpose linear通用线性IC Power management/电源管理IC Thermal management/热管理IC C

16、lock management/时钟管理IC Standard logic/标准逻辑IC Other logic/其它逻辑IC Memory/存贮器 Process/处理器 Optoelectronics光电IC RF射频IC IC package集成电路封装形式 Single package单列封装 Dual package双列封装 Quad package四列扁平封装 BGA package球栅列阵封装 CSP/chip scale package晶片级封装 Single package单列封装 SIP-THT单列通孔封装 SIP-SMT单列贴片封装 SIP-THT单列通孔封装TO-XXX

17、 SIP-SMT单列贴片封装 Dual package双列封装 DIP/Dual Inline Package双列直插封装 SOT-23/Standard Outline Transistor SC-70/Single Chip SOIC/Small Outline IC SSOP/Shrink Small Outline Package TSOP/Thin Small Outline Package TSSOP/Thin Shrink Small Outline Package DIP封装 Material封装材料Plastic DIP/nonhermetic package PDIP非密封

18、型 Ceramic DIP/hermetic package CDIP密封型* Size & Pin#1 index尺寸和第一脚位标识Popular body width is 300mils and 600mils通常的宽度是300毫英寸和600毫英寸 Properties of Some Examples of PDIP部分PDIP封装的属性 Lead CountWidthLengthThicknessPitchMax. Height 86.52 mm9.53 mm 3.24 mm 2.54 mm 4.19 mm 106.61 mm 22.86 mm3.94 mm 2.54 mm 4.95

19、 mm 12/16 6.61 mm 29.91 mm3.94 mm 2.54 mm 5.33 mm 2213.53 mm37.4 mm 7.75 mm 2.54 mm8.89 mm 2413.71 mm31.75 mm4.57 mm 2.54 mm5.08 mm 2813.525 mm37.4 mm4.07 mm 2.54 mm6.35 mm SOT-23/SC-70封装 Material材料Nonhermetic package非密封型 Size & Pin#1 indicator尺寸和第一脚位标识 Properties of some SOT-23 / SC-70 Package部分SOT

20、-23/SC-70封装的属性 Part # No. of Pins Body Length Body WidthBody Thickness Lead Pitch 5-L SOT-235115 mils 63 mils 40 mils37.5 mils 6-L SOT-236115 mils 63 mils40 mils37.5 mils 5-L SC70579 mils49 mils 35 mils25.5 mils 5-L SC70583 mils49 mils 35 mils25.5 mils SOIC封装 Material材料Nonhermetic package非密封型 TypeGu

21、ll wing leads欧翼型/SOIC J-type leads J型/SOJ Size & Pin#1 indicator尺寸和第一脚位标识SOIC不同的宽度 SOIC narrow(150mils)常用的 SOIC wide(300mils)常用的Properties of some SOIC部分SOIC封装的属性Part #No. of PinsLead StyleBody WidthQty Per TubeTape WidthTape PitchQty 13 ReelSO8G8Gull3.8mm9912mm8mm2,500SO14G14Gull3.8mm5016mm8mm2,500

22、SO16G16Gull3.8mm5016mm8mm2,500SO16G16Gull7.6mm4616mm12mm1,000SO20G20Gull7.6mm3824mm12mm1,000SO28G28Gull7.6mm2524mm12mm1,000SO44G44Gull13.3mm1724mm45mm750Properties of some SOJ部分SOJ封装的属性Part NumberNumber of PinsLead Style Body WidthQty PerTubeTape WidthTape Pitch Qty 13 ReelSO20/26J20/26J-Lead7.6mm25

23、24mm12mm1,000SO28J 28J-Lead7.6mm2724mm12mm1,000SO32J 32J-Lead7.6mm2524mm12mm1,000SO40J 40J-Lead10.0mm1544mm16mm500SO42J 42J-Lead10.0mm1544mm16mm500 SSOP Material材料Nonhermetic package 非密封型 Size & Pin#1 indicator尺寸和第一脚位标识Properties of some SSOP部分SSOP封装的属性Part NumberNo.of PinsBodyWidthPitchQtyPer TubeT

24、apeWidthTapePitchQty13 ReelSSOP885.3mm0.65mm15612mm8mm2,500SSOP14/16 14/165.3mm0.65mm100/8016mm12mm1,000SSOP20/24 20/245.3mm0.65mm66/6216mm12mm1,000SSOP28285.3mm0.65mm4716mm12mm1,000SSOP48487.6mm1.27mm3032mm12/16mm1,000SSOP56567.6mm1.27mm2632mm12/16mm500SSOP646410.2mm0.8mm44mm16/24mm500 TSOPNonherme

25、tic package非密封型 1.0mm thickness1.0毫米厚 Two typesTSOP I (leads from shorter edges) TSOP II (leads from longer edges)Properties of some TSOP-I type 部分TSOP-I封装的特性Part NumberNo. of PinsBody SizeLead PitchQty Per TrayTape WidthTape PitchQty 13 ReelTSOP20/2420/246 x 14.4mm0.5mm24024mm12mm1,000TSOP28288.1 x

26、 11.8mm0.55mm23424mm12mm1,000TSOP28/3228/328 x 18.4mm0.5mm15632mm12/16mm1,000TSOP404010 x 18.4mm0.5mm12032mm16mm1,000TSOP484812 x 18.4mm0.5mm9632mm16mm1,000Properties of some TSOP-II type部分TSOP-II封装的特性Part NumberNo. of PinsBody SizeLead PitchQtyPer TrayTapeWidthTape PitchQty 13 ReelTSOP20/24/2620/24

27、/267.6 x 17.14mm1.27mm17624mm12mm1,000TSOP24/28 24/2810.16 x 18.41mm 1.27mm10032mm16mm1,000TSOP323210.16 x 20.95mm 1.27mm11732mm16mm1,000TSOP40/44 40/4410.16 x 18.42mm 0.8mm13532mm16mm1,000TSOP505010.16 x 20.95mm 0.8mm11732mm16mm1,000TSOP545412.7 x 22.22mm0.8mm8444mm20mm1,000TSOP666610.16 x 22.22mm

28、0.65mm44mm20mm1,000 TSSOP Material材料Nonhermetic package非密封型 Size & Pin#1 indicator尺寸和第一脚位标识Properties of some TSSOP部分TSSOP封装的属性Part NumberNo. of PinsBody WidthPitchTape WidthTape PitchQtyPer TubeQtyPer ReelTSSOP8/10 8/103.0mm0.65mm12mm8mm982,500TSSOP14144.4mm0.65mm12/16mm8mm961,000/2,500TSSOP28284.4

29、mm0.65mm16mm8/12mm501,000TSSOP28/3228/326.1mm0.65mm24mm12mm50/441,000TSSOP38386.1mm0.65mm24mm12mm391,000TSSOP48/5648/566.1mm0.5mm24mm12mm39/351,000TSSOP56564.4mm0.4mm24mm12mm421,000TSSOP64646.1mm0.5mmN/AN/A28N/ATSSOP80806.1mm0.4mmN/AN/A28N/A Quad packageLQFP/Low-pro Flat Pack TQFP/Thin Quad Flat Pac

30、k MQFP/Metric Quad Flat Pack PLCC/Plastic Leaded Chip Carrier Package LQFP Material材料Nonhermetic package 非密封型 Size & Pin#1 indicator尺寸和第一脚位标识1.4mm thickness厚度1.4毫米 Properties of some LQFP部分LQFP封装的属性 TQFP Material材料Nonhermetic package 非密封型 Size & Pin#1 indicator尺寸和第一脚位标识1.0mm thickness厚度1.0毫米 Propert

31、ies of some TQFP部分TQFP封装的属性 MQFP Material材料Nonhermetic package 非密封型 Size & Pin#1 indicator尺寸和第一脚位标识2.0mm, 2.7mm, 3.5mm thickness厚度2.0毫米、2.7毫米、3.5毫米 Properties of some MQFP部分MQFP封装的属性 PLCCNonhermetic package非密封型 PBGA PackageNonhermetic package非密封型 IPC/JEDEC J-STD-013 CSP封装Package is no more than 1.2X

32、 of die封装尺寸不大于晶片的1.2倍 IPC/JEDEC J-STD-012 Also stand for chip size package有时也表示晶片尺寸封装 IC orientation集成电路方向识别A reference mark, chamfer, notch, tab, flat, or similar feature that identifies the number-one terminal position.一个参考的记号，斜面，槽口，横杠，或类似的标识去识别第一脚。IC group集成电路分类PIN#1 indicator第一脚识别符 IC packing集成电

33、路包装Reel tape卷带 Tubes管装 Trays托盘IC group集成电路分类IC packing集成电路包装 Reel & Tape Tray Tube Classification by function根据用途可分为General purpose linear通用线性IC Power management/电源管理IC Thermal management/热管理IC Clock management/时钟管理IC Standard logic/标准逻辑IC Other logic/其它逻辑IC Memory/存贮器 Process/处理器 Optoelectronics光电I

34、C RF射频ICIC group集成电路分类 General purpose linear通用线性ICOperational amplifier运算放大器 Comparator比较器 Driver驱动IC Interface接口IC Analog switch模拟开关ICGeneral purpose linear通用线性IC Power management电源管理ICRegulator调整器 LDO低压差调整器 DC/DC Converter电压变换IC Voltage reference电压参考IC Voltage supervisor电压监视IC PWM调制IC Battery man

35、agement电池管理ICPower management电源管理IC Thermal management热管理ICThermal sensor热感应器Thermal management热管理IC Clock management时钟管理ICClock时钟IC RTC实时时钟IC PLL锁相环IC Oscillator IC振荡ICClock management时钟管理IC Standard logic标准逻辑IC74/54 series74/54系列IC 4000 series4000系列ICStandard logic标准逻辑IC Other logic其它逻辑ICPLD可编程逻辑I

36、COther logic其它逻辑IC Memory存贮器EPROM EEPROM FLASH DRAM SRAMMemory存贮器Various memory comparisonTypeVolatile?Writeable?Erase SizeMax Erase CyclesCost (per Byte)SpeedSRAMYesYesByteUnlimitedExpensiveFastDRAMYesYesByteUnlimitedModerateModerateMasked ROMNoNon/an/aInexpensiveFastPROMNoOnce, with a device progr

37、ammern/an/aModerateFastEPROMNoYes, with a device programmerEntire ChipLimited(consult datasheet)ModerateFastEEPROMNoYesByteLimited(consult datasheet)ExpensiveFast to read,slow to erase/writeFlashNoYesSectorLimited(consult datasheet)ModerateFast to read,slow to erase/writeNVRAMNoYesByteUnlimitedExpensive(SRAM + battery)FastMemory存贮器 Process处理器MCU单片机OTP MASK MTP CPU DSPProcess处理器 Optoelectronics光电ICOptocoupler光耦ICOptoelectronics光电IC RF频射ICRF频射IC Hybrid IC混合集成电路IC group集成电路分类 Active oscillator有源振荡器XO VCXO TCXOActive oscillator group有源振荡器分类THE END此课件下载可自行编辑修改，供参考！感谢您的支持，我们努力做得更好！