新产品开发整体流程介绍(精)课件.ppt

1、1Presentation TitleC-System Introduction will cover Role & Responsibility (R&R) Process Cx Stage: C0: Proposal phase 構想階段 C1: Planning phase 規劃階段 C2: R&D Design phase 設計階段 C3: Lab Pilot Run phase 樣品試作階段 C4: Eng Pilot Run phase 工程試作階段 C5: PD Pilot Run phase 試產階段 C6: Mass Production phase 量產階段2Present

2、ation TitleRole & Responsibility FunctionResponsibilityPM產品經理- Product Manager (或計畫專案經理- Project Manager)為所負責計畫或產品線成敗之總負責人, 將依產品線之性質指定專人負責某類產品,必須對所負責產品線專業領域之發展及行銷雙方面皆有相當程度的了解. 並依照產品之條件及市場狀況,做適當的運用,訂定技術或產品市場競爭策略,並在適當的時機推出適當之技術或產品.TMTM is responsible to coordinate technical issues conflict among HW, S

3、W, ID and ME and decision-making. TM has to handle all project technical issues. PCC為規劃推廣、連絡及控制專案進行的負責人, 掌握專案進行之情況以協助處理異常狀況, 使新產品能順暢切入工廠且如期推出, 以提高產品競爭力.協助 R&D RELEASE 開發階段 BOM CHANGE NOTICE.R&DR&D 包括電子部門及工業設計部門,若只寫 HW (Hardware Design) 則指電子部門,若只寫 ID (INDUSTRIAL DESIGN) 則指工業設計部門; 包括ME, Thermal, Packi

4、ng design. 若只寫 SW (Software design) 則指軟體設計部門有負責 BIOS, Driver 及 Pre-load 不同工作性質之軟體開發功能. R&D 人員負責產品之開發、設計、測試規劃，包括 H/W、S/W及ID的開發、設計、提出新發明及著作權揭露書. - Wistron Case3Presentation TitleRole & Responsibility FunctionResponsibilityHW (Hardware Design)* Hardware is responsible for Electronic Engineering Design

5、* Co-works with S/W and QT to make sure that the every function works well according to spec. * H/W should conduct technical transfer to PE. * H/W should input, update, and maintain the bugs/issues information in the bug tracking system. SW (Software Design)* Software is responsible for the design o

6、f BIOS, Driver, Utilities, and S/W Preload. * S/W co-works with H/W and QT to make sure that every function works well according to the specification. * S/W has to release the SCD and the Cert. Team Document. * S/W should conduct technical transfer to TE. * S/W has to input/update/maintain the bugs/

7、issues information in the bug tracking system.ID/ME (Industrial Design/ Mechanical Engineering)* ID/ME is responsible for Mechanical Engineering, Thermal and Packing designs. * ID/ME should conduct technical transfer to PME. * ID/ME should input, update, and maintain the bugs/issues information in t

8、he bug tracking system used.- Wistron Case4Presentation TitleRole & Responsibility FunctionResponsibilityPA (EMI/Safety, QT, CE/Reliability, PCB, OS Certification)為產品保證暨開發支援Function之總稱, 主要負責根據 MRS/PES 執行各項產品之測試, 諸如 EMC/Safety : REGULATORY TEST , CE : RELIABILITY TEST 及 KEY COMPONENT APPROVAL , PCB :

9、 PCB LAYOUT, DC : BOM , OS : OS 認證 etc;EMC/SafetyAll products to meet EMC/Safety requirements and guarantee the legality in the international marketing. 申請產品之安規、測試、Debug. QT為R&D轄下所屬之測試單位人員,主要負責各項產品之測試,諸如COMPATIBILITY TEST, SOFTWARE TEST, S/W PRELOAD TEST, DIAGNOSTIC PROGRAM TEST ,ETC.,CE/Reliability

10、組件承認測試、不良品故障分析及其他附件等材料品質之管制及保證 產品相關之可靠度與環境實驗，以及可靠度工程之研究與制定. PCBPCB Layout之申請、PCB之設計、Orcad library & Mentor library的建立與管理. 信號品質CAE分析, PCB layout外包廠商之管理，PCB製造廠商之管理. OS Certification執行公司各產品之 OS 相容性認證測試及 LOGO 申請. O.S. Beta Site 測試 PDM料號編碼及控管,BOM製作 - Wistron Case5Presentation TitleRole & Responsibility F

11、unctionResponsibilityAM (Account Manager)1.爭取訂單與客戶合約協商. 2.協調產品SPEC.工程變更 SAMPLE APPROVAL.3.適時反應市場需求與趨勢. MM (Material Management)1.MM is responsible for new supplier development, parts purchasing2.Controlling mechanical tooling status including the schedule, capacity, parts readiness, concerns3.Manage

12、 the dependencies, long lead-time items. 4.MM also co-works with SQM and CE for component quality improvement and the key component QVL final versionSQM (Supplier Quality Management)* 零件品質管理及參與分包商之評鑑/管理 (SQRC Plan/Status)* 負責異常材料分析、追蹤與改善.* 負責進行產品 QVL CANDIDATE APPROVAL 作業系統 AT mfg. GCSD1.開發及推動全球客戶服務

13、及支援計劃.2.各項售後服務及支援作業.3.參與 Field 品質改善作業 (EWG)FI負責評估 Project Cost , 決定 Project 是否可行以及 Project 所花費之 Cost. Legal合約及專利審核- Wistron Case6Presentation TitleRole & Responsibility FunctionResponsibilityCFECFE acts on behalf of Wistron global manufacturing operation to deal with the customer, and also acts as a

14、 representative of the customer when dealing with internal Wistron teams. Based on the C4/C5 checklist, related reports and project status, CFE is responsible to conclude the exit judgment (Ready or Not ready) during C4/C5 Exit meetings to determine whether a product can move on to PD pilot run/MP o

15、r notNPI1.負責規劃、協調、整合與提供各 Site製造所需相關資訊與技術資料2.協調安排新產品轉移至海外生產工廠 3.協調處理海外生產工廠發生之生產相關問題 PE/PME1.產品設計審查, 產品問題之發覺及產品移交.2.協助生產良率提昇,克服生產瓶頸,提高生產力. 3.協助訂定製造規格及引進新的製作技術,進行改善以確保產品品質. IE1.設計及管理一個高效率的整合製造系統.2.消除浪費、杜絕不合理，提高生產力 3.生產流程規劃、製程改善、標準工時製定 QA1.執行製程及產品之檢驗並反應品質報告請相關單位改善品質 2.收集及處理市場及客戶品質回饋資料反應相關單位改善品質 3.協助工程單位

16、必要之驗證測試. 4.建立PCBA,Final Assembly之檢驗標準QE1.執行 DQA.FDI, MTBF, ORT Test2.執行產品開發過程之可靠度及環境測試 (C4)3.協助工程測試驗證 4.品質工程問題分析與解決 - Wistron Case7Presentation TitleRole & Responsibility FunctionResponsibilityPD (Production)PD has to work with PE, PME and IE respectively to get testing equipment & tools, assembly t

17、ools, and SOP ready before C5 Exit. PD is responsible to produce the product. PD is not just for efficiency only but also quality.PSE (Process Engineer)PSE is responsible for SMT process and for releasing the SMT pilot run report. PSE is also responsible for the process continuous improvement (CIP).

18、FAE (Failure Analysis Engineer) or REFAE is responsible for issuing the failure analysis report and forwarding this to related departments for product quality improvement. FAE is also responsible for preparing repair SOP if applicable.TETE is responsible for providing and maintaining Test Plan and T

19、est Program. TE also implement all the preload to production line and report the problems related to preload to preload team.PMC/GPMC (Plan Material Control/ Global Plan Material Control)GPMC/PMC is responsible for product fulfillment, final shipping model, supply site and capacity plan, and ramp up

20、 plan for all sites.- Wistron Case8Presentation TitleWistron C-System Quality ControlProposalPhasePlanningPhaseR&DDesignPhaseLabPilot-runPhaseEngineeringPilot-runPhaseProductionPilot-runPhaseMassProductionPhaseC0C1C2C3C4C5CheckPointWistron C- PhaseNPIFDI/MTBFDQA/PQC/ FQC Compatibility/Diagnostic-Sim

21、ulation Test-Layout & drawing-Signal Integrity-DFX Check-AVL-C-Test Plans Reliability/Stress EMI/ Safety OS & Pre-LoadWIH/WPH/WZS/WKS-MRS Check-Service Cost Estimate-Simulation-Design Peer Review -Lessons LearnedAvailabilityDevelop PlanLaunch FAI & SPCMTBF DemoCIP/CLCAPareto AnalysisEWG ReadyAFRTest

22、 ReportsPre-QVL ReadyDiagnostics ProgramBug List & ActionDCN/ECN/ECR FAI report PFMEASQRCTrainingMTBF ReviewQMP/QPA/QSAFPYRPPAPServiceability DesignTest PlansIntegrate Design Review Signal QualityDFX IndexInitial Supplier AuditMemorandumDFMEASimulationMTBF EstimateMVPConcept/ProposalMRS Definition S

23、copeSCEInvestigation& ProposalDesign & SourcingIntegrationValidationReleaseProduct Life CycleC6OOB/OBAORT/StressEWG/FQHAFR/DOA9Presentation TitleNew C System ArchitectureProgressC0 ExitC0 ActivityC0 EntryC1 ExitC1 ActivityC1 EntryC2 ExitC2 ActivityC2 EntryC3 ExitC3 ActivityC3 EntryC4 ExitC4 Activity

24、C4 EntryC5 ExitC5 ActivityC5 EntryC6 ExitC6 ActivityC6 EntryTimeDetail ActivitiesSubjectScopeDefinitionProcedure.Activities DefinitionRecord & ReportFormat DefinitionEscalation RuleMeasurementStandardProject Management & System Maintenance10Presentation TitleNew C System Product DevelopmentProposal

25、PhasePlanning PhaseR&D Design PhaseLab Pilot Run PhaseEng. Pilot Run PhaseProduction Pilot run PhaseMass production phaseC2 meetingC3 meetingC4 meetingC5 meeting C3 checklist HW DV test report SW FV test report ME test report Reliability test report (prel.) ME/Artwork/packing drawing PAL/ROM data li

26、sting C3 manufacturability review report Sample approvestatus & bug list review C4 checklist BOM QVL Time standard System BIOS/KBCFW release S/W Driver/AP/Utility/DiagnosticRelease EE Eng. P/R report SMT WS P/R report PCBA WS P/R report ME Eng. P/R report Eng. P/R QA review report Schematics & jumpe

27、r setting Test program/Procedure SOP for PCBA/FA User manual R/N Packing standard Compatibility test report Reliability and C4 Reliability test report Key Component verification Spare parts list C5 checklist Service Guide EMC Safety report PD P/R yield rate analysis rpt PCBA inspection instruction P

28、roduct inspection instruction MTBF DEMO test reportPMPMC0 meetingC1 meetingPM C1 checklist Inventiondisclosure Time schedule Project team Model number define Green design guide and reviewcheck list Non QVL/Sampleapproval request form C2 checklist PES EMC/Safety Request Form BOM/QVL(Prel.) PCB Layout

29、 (prel.) Outsourcing modulespecificationPMNPIC0C1C2C3C4C5C6C6 meetingGCSD C6 checklist Product phaseout noticeC0 ChecklistMRSC0/PM C0 Meeting11Presentation Title階段 C0構想階段 (Proposal Phase) 負責單位 計畫經理 (Project Manager) 或產品經理 (Product Manager) 目的 * 確訂提案構想或市場需求規格書 (MRS)* 可行性分析 工作重點 * 相關提案之市場資料搜集* 相關提案之關鍵

30、技術資料搜集* R&D 提出技術可行性分析* PM 執行可行性及效益評估審核會議 C0目的 評估是否成立專案計畫，進行研發 檢核項目 計畫提案書或市場需求規格書 (MRS) C0-C0-工作重點及檢核項目工作重點及檢核項目12Presentation TitleNew C System Product DevelopmentProposal PhasePlanning PhaseR&D Design PhaseLab Pilot Run PhaseEng. Pilot Run PhaseProduction Pilot run PhaseMass production phaseC2 meet

31、ingC3 meetingC4 meetingC5 meeting C3 checklist HW DV test report SW FV test report ME test report Reliability test report (prel.) ME/Artwork/packing drawing PAL/ROM data listing C3 manufacturability review report Sample approvestatus & bug list review C4 checklist BOM QVL Time standard System BIOS/K

32、BCFW release S/W Driver/AP/Utility/DiagnosticRelease EE Eng. P/R report SMT WS P/R report PCBA WS P/R report ME Eng. P/R report Eng. P/R QA review report Schematics & jumper setting Test program/Procedure SOP for PCBA/FA User manual R/N Packing standard Compatibility test report Reliability and C4 R

33、eliability test report Key Component verification Spare parts list C5 checklist Service Guide EMC Safety report PD P/R yield rate analysis rpt PCBA inspection instruction Product inspection instruction MTBF DEMO test reportPMPMC0 meetingC1 meetingPM C0 Checklist MRS C2 checklist PES EMC/Safety Reque

34、st Form BOM/QVL(Prel.) PCB Layout (prel.) Outsourcing modulespecificationPMNPIC0C1C2C3C4C5C6C6 meetingGCSD C6 checklist Product phaseout noticeC1 checklistInventiondisclosureTime scheduleProject teamModel number defineGreen design guide and reviewcheck listNon QVL/Sampleapproval request formC1/PMC1

35、Meeting13Presentation TitleC1-C1-工作重點及檢核項目工作重點及檢核項目階段 C1規劃階段 (Planning Phase) 負責單位 計畫經理 (Project Manager) 或產品經理 (Product Manager) 目的 * 規格的擬訂* 專案組織的成立* 專案時程的規劃 工作重點 * 選任技術經理 (Technical Manager, 簡稱TM) 並成立專案組織* 計畫專案經理(Project Manager)或產品經理，規劃專案時程* 召開C1審核會議* 法務確認Legal Concern、如Potential Patent List, Inv

36、ention Disclosure* 成立專案團隊 審核會議 C1目的 成立專案團隊、確定開發時程 檢核項目 Time ScheduleProject TeamInvention DisclosureGreen Design Check ListSample Request Form 14Presentation Title15Presentation TitleCase - bottle Coca in England開採鋁礦開採鋁礦一噸鋁土提鍊半噸氧化鋁一噸鋁土提鍊半噸氧化鋁半小時加工半小時加工半噸氧化鋁熔煉成半噸氧化鋁熔煉成1/4噸金屬鋁噸金屬鋁再加工二週成鋁錠再加工二週成鋁錠瑞典或梛威

37、瑞典或梛威熔爐工廠熔爐工廠澳大利亞澳大利亞澳大利亞澳大利亞化學還原工廠化學還原工廠加熱至華氏加熱至華氏900度度壓延成壓延成1/8 inch薄片薄片瑞典和德國瑞典和德國壓延廠壓延廠船運一個月船運一個月冷軋成冷軋成1/80 inch薄片薄片冷軋廠冷軋廠英國易開罐廠英國易開罐廠成型，清洗，烘乾，防鏽成型，清洗，烘乾，防鏽裝填，印刷裝填，印刷英國可樂廠英國可樂廠消費消費鋁罐回收儘鋁罐回收儘16%16Presentation TitleEcological Rucksack (生態包袱生態包袱)生產一片半導體晶片所產生之廢料為產生產一片半導體晶片所產生之廢料為產品重量之品重量之十萬倍十萬倍生產一台筆記

38、型電腦所產生之廢料為產生產一台筆記型電腦所產生之廢料為產品重量之品重量之四千倍四千倍生產一公升佛羅里達橘子汁需要生產一公升佛羅里達橘子汁需要兩公升兩公升汽油及一千公升之水汽油及一千公升之水生產一噸紙需用掉生產一噸紙需用掉九十八噸九十八噸之其他資源之其他資源 資料來源資料來源 : 綠色資本主義綠色資本主義 天下出版社天下出版社17Presentation TitleEU RoHS Directive 指令期程指令期程 2003.01.27 指令發布指令發布 2003.02.13 歐盟公報發行歐盟公報發行,指令生效指令生效 2004.08.13 轉為會員國當地法律轉為會員國當地法律,法規或行政指令

39、法規或行政指令 2006.07.01 新投入之產品不得含有禁用物質新投入之產品不得含有禁用物質 指令要求指令要求/禁用項目禁用項目 鉛鉛 (Pb) 鎘鎘 (Cd) 汞汞 (Hg) 六價鉻六價鉻 (Cr6+) 多溴聯苯多溴聯苯(PBB) 多溴化二苯乙醚多溴化二苯乙醚(PBDE)(The restriction of the use of certain hazardous substances in electrical and electronic equipment)18Presentation TitleEU RoHS 管制規格管制規格SubstancesE.U. 建議值Lead (Pb)

40、 鉛 ; 銲錫1000 PPMLead (Pb) 鉛 ; 塑膠,線材,塗料1000 PPMCadmium (Cd) 鎘100 PPMMercury (Hg) 汞1000 PPMHex. Chromium (Cr6+) 六價鉻1000 PPMPBB (聚溴聯苯) 1000 PPMPBDE (聚溴二苯醚)1000 PPM重金屬：重金屬：汞、鉛、鎘、六價鉻汞、鉛、鎘、六價鉻溴性耐燃劑：聚溴聯苯溴性耐燃劑：聚溴聯苯( (PBBPBBs s) )、溴聯苯醚溴聯苯醚( (PBDEPBDEs s) )註：另有註：另有管制規範外管制規範外的項目的項目19Presentation TitleEU WEEE Di

41、rective Directive 2002/96/ECDirective 2002/96/EC期程期程 2003.01.27 2003.01.27 指令發布指令發布 2003.02.13 2003.02.13 歐盟公報發行，指令生效歐盟公報發行，指令生效 2004.08.13 2004.08.13 轉為會員國當地法律轉為會員國當地法律, ,法規或行政指令法規或行政指令 2005.08.13 2005.08.13 完成回收系統建構完成回收系統建構, ,製造商因應回收之製造商因應回收之 財務規劃就緒財務規劃就緒 2006.12.31 2006.12.31 回收再利用率達每人每年回收再利用率達每人

42、每年4 4kgkg 2008.12.31 2008.12.31 訂定下階段目標訂定下階段目標 回收回收Target of Recovery and RecyclingTarget of Recovery and Recycling(Waste Electrical and Electronic Equipment)WEEE Category Large household appliances Small household appliances IT & telecommunications appliances Consumer equipment Lighting equipment E

43、lectrical and electronic tools Toys, leisure & sports equipment Medical devices Monitoring and control instruments Automatic dispensers Rate of Recovery Rate of Recycling 80% 75% 70% 50% 75% 65% 75% 65% 70% 50% 70% 50% 70% 50% * * 70% 50% 80% 75% * To be determined by 31 December 2006 20Presentation

44、 TitleNew C System Product DevelopmentProposal PhasePlanning PhaseR&D Design PhaseLab Pilot Run PhaseEng. Pilot Run PhaseProduction Pilot run PhaseMass production phaseC2 meetingC3 meetingC4 meetingC5 meeting C3 checklist HW DV test report SW FV test report ME test report Reliability test report (pr

45、el.) ME/Artwork/packing drawing PAL/ROM data listing C3 manufacturability review report Sample approvestatus & bug list review C4 checklist BOM QVL Time standard System BIOS/KBCFW release S/W Driver/AP/Utility/DiagnosticRelease EE Eng. P/R report SMT WS P/R report PCBA WS P/R report ME Eng. P/R repo

46、rt Eng. P/R QA review report Schematics & jumper setting Test program/Procedure SOP for PCBA/FA User manual R/N Packing standard Compatibility test report Reliability and C4 Reliability test report Key Component verification Spare parts list C5 checklist Service Guide EMC Safety report PD P/R yield

47、rate analysis rpt PCBA inspection instruction Product inspection instruction MTBF DEMO test reportPMPMC0 meetingC1 meetingPM C0 Checklist MRSPM C1 checklist Inventiondisclosure Time schedule Project team Model number define Green design guide and reviewcheck list Non QVL/Sampleapproval request formN

48、PIC0C1C2C3C4C5C6C6 meetingGCSD C6 checklist Product phaseout noticeC2 checklistPESEMC/Safety Request FormBOM/QVL(Prel.)PCB Layout (prel.)Outsourcing modulespecificationC2/PMC2 Meeting21Presentation TitleC2 -C2 -工作重點及檢核項目工作重點及檢核項目階段 C2設計階段 (R&D Design Phase) 負責單位 技術經理 (Technical Manager)研發部門 目的 * 軟、硬

49、體、機構設計* 証實設計可行性* 修正軟、硬體、機構規格 工作重點 * 電路設計並完成電路圖* 機構設計並完成機構設計圖* 機電整合設計並完成機電介面設計* 軟體設計並完成初步版本* 電路設計Review* 機構設計Review* 機電整合設計Review* 建立初步之測試計畫(硬體、軟體、機構) 審核會議 C2目的 * 確定計畫規格* 檢討設計階段之工作成效* 決定是否進入樣品試作* 查核是否發出專利之申請 檢核項目 Schematics (Preliminary)S/W SpecificationMechanical & ThermalTest PlanInvention Disclosu

50、re Invention Disclosure22Presentation TitleNew C System Product DevelopmentProposal PhasePlanning PhaseR&D Design PhaseLab Pilot Run PhaseEng. Pilot Run PhaseProduction Pilot run PhaseMass production phaseC2 meetingC3 meetingC4 meetingC5 meeting C4 checklist BOM QVL Time standard System BIOS/KBCFW r